BOE Establishes Microdisplay Development Infrastructure in Beijing… Unveils a Range of AR/VR Products and Roadmap at the 2025 BOE IPC

0.49-inch 4496ppi OLEDoS AR glasses unveiled at BOE IPC 2025 (Source: BOE)
BOE will convert the clean room of its fifth-generation B1 LCD line in Beijing, China, to create an OLEDoS (silicon-based OLED) production infrastructure. The investment will be funded by the Beijing B20 base and will utilize existing equipment and infrastructure to shorten process validation and yield ramp-up time. This is not a simple expansion, but rather a strategy to internalize silicon microdisplay in Beijing and secure an early mass production system.
BOE unveiled its microdisplay roadmap and new products at the 2025 International Partner Conference (IPC) and related events. BOE demonstrated its technology and commercialization commitment to next-generation applications such as high-resolution AR/VR devices, and BOE will focus its R&D and investment on high-resolution LCDs of 2,000 ppi and above, as well as LEDoS and OLEDoS. In addition, the company plans to establish a new microdisplay production base in Beijing and to secure technology independence by shifting from relying on external design houses to developing its own silicon (Si) backplane technology.
BOE has also reorganized its portfolio by market segment. The premium market will be served by LEDoS and OLEDoS, while the mid-range market will be served by developing and producing AMOLED panels for VR at its Chongqing base. For the entry-level market, a 2,000 ppi LTPS-LCD microdisplay line will be launched at Beijing B20 to enhance cost competitiveness and volume responsiveness. Separately, the transition to MLED backplanes is underway at the Ordos B6 line. The plan is to leverage Gen 5.5 assets to improve the uniformity and reliability of key processes such as sputtering-based metal-electrode thin-film formation, and to advance process maturity by optimizing low-resistance wiring and contact characteristics required for large-area operation.
BOE’s move is likely to change the competitive landscape with Sony, Samsung Display, and others in the AR/VR market. In-house development of the silicon backplane is expected to speed up product launches by shortening the feedback loop for design changes, performance improvements, and power optimization.
The infrastructure shift to Beijing is also expected to enhance supply chain stability and customization responsiveness. By consolidating design, optics, software, and solutions capabilities in Beijing, the plan is to reduce lead times for customization and product generation transitions.
Changho Noh, Senior Analyst at UBI Research (chnoh@ubiresearch.com)





















