Photolithography-based OLED processes: Challenges and opportunities for next-generation display innovation

Patterning process with MAX OLED™ from Applied Materials
OLED technology has become the centerpiece of smartphone displays due to its superior image quality and flexibility. The fine metal mask (FMM) process is currently the dominant technology for patterning RGB subpixels in small and medium-sized OLED displays, such as smartphones.
However, conventional FMM methods suffer from limited aperture (around 30%), uneven brightness due to increased electrical resistance, and high production costs. Due to the sensitivity of OLED materials, photolithographic patterning, which was considered as an alternative to FMM, has also been difficult to commercialize due to concerns about OLED damage during the process.
Applied Materials presented its MAX OLED™ process technology at the SID 2025 conference. MAX OLED™ utilizes a proprietary pixel architecture and a novel process to capitalize on the advantages of conventional photolithography while compensating for the sensitivity of OLED materials. In particular, the sensitive organic layer is protected by thin film encapsulation (TFE) immediately after OLED deposition, which enables multiple complex photolithography and etching processes.
The MAX OLED™ process doubles the aperture ratio compared to FMM, significantly improving pixel brightness, resolution, and display lifetime. In addition, the localized cathode contact structure solves the problem of increased electrical resistance and reduces power consumption by 33% for notebook PC displays and 47% for monitor displays. High resolutions of up to 2,000 ppi are possible, and individual optimization of each RGB color OLED stack is also possible.
From an economic perspective, MAX OLED™ also makes a positive difference. It shortens new product development cycles by significantly reducing photomask lead times and lowering costs compared to FMM. It also increases glass utilization through multi-product in a mother glass (MMG), which is widely applied in LCD processes, and contributes to material cost reduction by approximately doubling OLED material utilization with short source-to-substrate distances.
Visionox recently announced that it is investigating a maskless process (ViP, Visionox intelligent Pixelization) using its MAX OLED™ process to produce 8th generation OLEDs. While Visionox’s announcement is a positive sign for the commercial viability of photolithography-based OLED processes, the company is cautious about investing in mass production as it has not yet achieved sufficient yields. This shows that the complex photolithography process and yield stabilization of MAX OLED™ technology still needs to be validated. The TFE process after OLED deposition for each RGB color, followed by repeated photolithography and etching, requires high precision and process control, which is the main factor contributing to the difficulty in securing yields. The fact that Samsung Display is also conducting pilot evaluations of the MAX OLED™ process demonstrates that the technology is gaining traction with major industry players.
In conclusion, MAX OLED™ is a promising technology that will overcome the limitations of the existing FMM process and revolutionize the performance of next-generation OLED displays. Although the challenge of achieving yields due to the complexity of the process remains, the attention of leading companies in the display industry strongly suggests that MAX OLED™ has the potential to emerge as a key technology to drive the future display market. This will open up the possibility of new applications such as VR displays, transparent OLEDs, and under-panel camera (UPC) integration.
Changho Noh, Analyst at UBI Research (chnoh@ubiresearch.com)